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Yuhan Lin#, Wenqing Zhang#, Hua Guo, Jiawen Liu, Junliang Zhang*, Yongqiang Guo, Junwei Gu*. Simultaneously improving thermal conductivities and mechanical strength of carbon fibers/epoxy composites via CNT/copolymer hybrid interphase. Thermo-X, 2026, 2: 202618.
http://doi.org/10.70401/tx.2026.0023
Abstract
Carbon fibers (CF)/epoxy composites are widely utilized in aerospace and transportation due to their light weight and high specific strength/modulus. However, poor interfacial binding between CF and the epoxy matrix leads to phonon scattering and inefficient load transfer, causing heat accumulation and reduced service life in high-power electronic systems. In this study, CF was coated with a styrene, benzocyclobutene, and methyl methacrylate units containing polymer layer mixed with carbon nanotubes (CNT) through impregnation and drying. The polymer layer was then thermally crosslinked to obtain the polymer and CNT coated CF (CF@(CNT/P)). CF@(CNT/P) was then applied as reinforced fibers and epoxy resin containing a liquid crystal structure as the matrix to prepare CF@(CNT/P)/epoxy composites. The π-π interactions and hydrogen bonds between CF and epoxy resin were enhanced by the benzene ring and ester groups in the polymer, thereby improving the interfacial binding between epoxy resin and CF. CF@(CNT/P)/epoxy composite showed enhanced load-bearing and thermal conduction performance. When the mass fractions of CNT and copolymer in CNT/P/dichloromethane (DCM) solution were 0.03 wt% and 0.1 wt%, respectively, the CF@(CNT/P) had the best interfacial binding to the epoxy resin. The interlaminar shear strength and flexural strength of the CF@(CNT/P)/epoxy composite increased from 23.7 and 252.5 MPa of CF/epoxy composite to 31.4 and 369.1 MPa, respectively. Meanwhile, the in-plane (λ∥) and through-plane (λ⊥) thermal conductivity values were improved from 7.15 and 0.31 W/(m·K) of CF/epoxy composite to 10.08 and 0.58 W/(m·K), respectively. The CF@(CNT/P)/epoxy composite also demonstrated an electromagnetic interference shielding effectiveness of 38.6 dB which has broad application in high-power electronic information systems.
碳纤维（CF）/环氧树脂复合材料因其质轻、比强度/模量高，广泛应用于航空航天、交通运输等领域电子电气元器件。然而CF与环氧树脂基体界面结合不佳，导致热量传递过程中声子在界面处易发生散射以及载荷无法有效传递，使机载、车载电子系统在高功率密度下产生热积聚并且承载能力受限，影响其使用寿命和服役稳定性。本文采用碳纳米管（CNT）与含苯乙烯、苯并环丁烯和甲基丙烯酸甲酯基元的无规共聚物配制二氯甲烷混合液（CNT/P/DCM），经“浸渍-干燥-热交联”处理CF得到表面包覆有CNT和聚合物膜的CF（CF@(CNT/P)）。将其与含液晶结构的环氧树脂复合（CF@(CNT/P)/环氧树脂），利用共聚物中的苯环、酯基结构增强CF与环氧树脂之间的π-π堆叠和氢键提高环氧树脂与CF界面结合作用，提升复合材料的承载/导热性能。当CF质量分数为60 wt%时，且CNT/P/DCM混合液中CNT和共聚物的质量分数分别为0.03 wt%和0.1 wt%时，CF@(CNT/P)/环氧树脂复合材料的层间剪切强度（ILSS）和弯曲强度分别达31.4 MPa和369.1 MPa，面内导热系数（λ∥）和面间导热系数（λ⊥）分别为10.08 W/(m·K)和0.58 W/(m·K)，均高于CF/环氧树脂复合材料（ILSS、弯曲强度、λ∥和λ⊥分别为23.7 MPa、252.5 MPa、7.15 W/(m·K)和0.31 W/(m·K)）。CF@(CNT/P)/环氧树脂复合材料还具有较好的电磁屏蔽效能（38.6 dB），在高功率电子器件中展现了广阔应用前景。
第一作者：林予涵、张文卿
邮件地址：linyuhan@mail.nwpu.edu.cn、18810667396@163.com