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SFPC课题组高导热PBO纳米复合纸工作发表在Nano-Micro Letters上
来源:顾军渭教授个人网站 发布日期:2024-10-11

Lin Tang, Kunpeng Ruan, Xi Liu, Yusheng Tang*, Yali Zhang and Junwei Gu*. Flexible and robust functionalized boron nitride/poly(p-phenylene benzobisoxazole) nanocomposite paper with high thermal conductivity and outstanding electrical insulation. Nano-Micro Letters, 2024, 16: 38. 2023IF=31.6 (1区材料科学Top期刊,中国科技期刊卓越行动计划-领军类期刊项目)

https://doi.org/10.1007/s40820-023-01257-5

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare benzidine functionalized boron nitride (m-BN). And the m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures prepared via sol-gel film transformation approach.The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π-π electron interaction between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ∥and λ⊥are 9.68 W/(m·K) and 0.84 W/(m·K), and the volume resistivity & breakdown strength are as high as 2.3×1015Ω·cm and 324.2 kV/mm, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640oC, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

随着5G信息技术的快速发展,高集成化的电子器件和电气设备的导/散热问题愈加突出,亟需设计制备出兼具优异导热性能和电绝缘性能的聚合物基复合纸。本文采用“高温固相-重氮盐分解”法将联苯胺接枝在氮化硼(BN)表面制备功能化BN(m-BN),与有机酸解离制备的聚对苯撑苯并二噁唑纳米纤维(PNF)复合,采用“溶胶-凝胶”薄膜转化工艺制备仿贝壳珍珠层结构的m-BN/PNF纳米复合纸。基于m-BN与PNF之间的氢键、π-π电子相互作用以及内部的仿贝壳珍珠层结构,50 wt% m-BN的m-BN/PNF纳米复合纸展现出优异的导热性能、出色的电绝缘性能、优异的力学性能和突出的热稳定性,其λ∥和λ⊥分别为9.68 W/(m·K)和0.84 W/(m·K),体积电阻率和击穿强度分别高达2.3×1015 Ω·cm和324.2 kV/mm,拉伸强度为193.6 MPa,热分解温度为640oC,有望在电子器件和电气设备等高端热管理领域获得广泛的应用。


论文亮点

1. 基于功能化氮化硼与PNF的π-π作用,诱导BN均匀分布在PNF网络中,赋予纳米复合纸优异的导热性能和突出的热管理能力。

2. 采用溶胶-凝胶薄膜转化工艺,在m-BN/PNF纳米复合纸中构筑仿贝壳珍珠层结构,其拉伸强度和拉伸模量高达193.6 MPa、3.72 GPa。

3. 基于有序的层状结构,带电载流子纳米复合纸中进行多次迁移,使其体积电阻率和击穿强度分别高达2.3×1015 Ω·cm和324.2 kV/mm。


第一作者:唐林

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